1. 定点切割(Precision Cutting)2. 穿透式电子显微镜试片制作(TEM sample preparation)3. 低阶IC线路修补和布局验证(IC circuit editingverification)4. 制程上异常观察分析(Abnormal process analysis)5. 晶相特性观察分析(Ion Channeling Contrast for Grain Morphology Observation) 6. 故障位置定位用被动电压反差分析(Passive Voltage Contrast  Analysis for Fault Isolation)